Gyeonggi-do
South Korea
13
2024-12-05
The entities that hold a legal rights for patent applications filed by inventor Bang Won Bae:
Won Bae Bang from Gyeonggi-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
#2 | 2024-08-01METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
#3 | 2023-08-03METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
#4 | 2023-03-16Semiconductor package having routable encapsulated conductive substrate and method
#5 | 2021-04-15Method of forming a molded substrate electronic package and structure
#6 | 2020-08-13Semiconductor package having routable encapsulated conductive substrate and method
#7 | 2018-11-08Semiconductor package having routable encapsulated conductive substrate and method
#8 | 2018-06-07Method of forming a molded substrate electronic package and structure
#9 | 2017-03-09Semiconductor package having routable encapsulated conductive substrate and method
#10 | 2017-01-05Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure
#11 | 2016-11-24Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
#12 | 2016-09-22Electronic package structure having insulated substrate with lands and conductive patterns
#13 | 2016-08-04Packaged electronic device having reduced parasitic effects and method
1613657 ⎘