Windsor, Colorado
United States
5
2019-04-25
The entities that hold a legal rights for patent applications filed by inventor Perkins Nathan:
Nathan Perkins from Windsor, US has applied for patents for these inventions. The list has both pending applications and granted patents:
MICROCAPPED PACKAGE HAVING POLYMER STANDOFF
#2 | 2016-12-01Semiconductor structure having thermal backside core
#3 | 2016-08-25Semiconductor structure including a thermally conductive, electrically insulating layer
#4 | 2016-08-18Semiconductor structure having thermal backside core
#5 | 2016-08-04Apparatus and semiconductor structure including a multilayer package substrate
1613660 ⎘