Hackensack, New Jersey
United States
6
2018-10-18
The entities that hold a legal rights for patent applications filed by inventor Sinha Tuhin:
Tuhin Sinha from Hackensack, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Control warpage in a semiconductor chip package
#2 | 2018-03-15Test cell for laminate and method
#3 | 2017-09-21Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
#4 | 2017-07-06Scanning acoustic microscope sensor array for chip-packaging interaction package reliability monitoring
#5 | 2017-06-22Test cell for laminate and method
#6 | 2016-08-04Polygon die packaging
1613696 ⎘