Boise, Idaho
United States
10
2016-08-18
The entities that hold a legal rights for patent applications filed by inventor Tuttle Mark:
Mark Tuttle from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Signal delivery in stacked device
#2 | 2011-09-29Through-wafer interconnects for photoimager and memory wafers
#3 | 2010-07-08Through-wafer interconnects for photoimager and memory wafers
#4 | 2008-05-15Through-wafer interconnects for photoimager and memory wafers
#5 | 2007-06-07Method for testing semiconductor components using bonded electrical connections
#6 | 2007-01-11System for testing semiconductor components
#7 | 2007-01-04Interconnect for testing semiconductor components
#8 | 2006-08-17Method for testing semiconductor components
#9 | 2006-03-02Through-wafer interconnects for photoimager and memory wafers
#10 | 2005-08-02Method of forming a structure for supporting an integrated circuit chip
1627301 ⎘