Russ Alan REISNER

REDUCING IMPEDANCE MATCHING COMPONENTS IN FRONT END ARCHITECTURES FOR MULTI-BAND TRANSMIT AND RECEIVE FUNCTIONS

CONGLOMERATING TRANSMISSION CONTOURS TO IMPROVE TRANSMISSION PERFORMANCE FOR RADIO-FREQUENCY COMMUNICATIONS

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

OUTPUT MATCHING CIRCUIT WITH SUPPRESSED HARMONICS

NESTED FILTERS

Power amplifier output matching with suppressed harmonics

REDUCING IMPEDANCE MATCHING COMPONENTS IN FRONT END ARCHITECTURES FOR MULTI-BAND TRANSMIT AND RECEIVE FUNCTIONS

CONGLOMERATING TRANSMISSION CONTOURS TO IMPROVE TRANSMISSION PERFORMANCE FOR RADIO-FREQUENCY COMMUNICATIONS

Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same

Apparatus and methods for power amplifier output matching

STACKED WAFER-LEVEL PACKAGING DEVICES

Power amplification system with reactance compensation

Devices and methods related to nested filters

Common base pre-amplifier

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Network with integrated passive device and conductive trace in packaging substrate and related modules and devices

Power amplification system with reactance compensation

Reducing coupling coefficient variation using an angled coupling trace

Power amplification system with reactance compensation

Stacked wafer-level packaging devices

Systems and methods related to linear and efficient broadband power amplifiers

Devices and methods related to stacked duplexers

Power amplification system with common base pre-amplifier