Tsuyoshi KIDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2022-12-08

Top Assignees for applications by Tsuyoshi KIDA

The entities that hold a legal rights for patent applications filed by inventor KIDA Tsuyoshi:

Mitsubishi Gas Chemical Company, Inc. 9 Tokyo, Japan
RENESAS ELECTRONICS CORPORATION 5 Tokyo, Japan
Renesas Electronics Corporation 2 Koutou-ku, Tokyo, Japan
NEC ELECTRONICS CORPORATION 1 Kanagawa, Japan

Recent patent applications by KIDA Tsuyoshi

Tsuyoshi KIDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-08

US20220389130A1

Chemistry; metallurgy

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE

#2 | 2022-12-01

US20220380508A1

Chemistry; metallurgy

RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE

#3 | 2022-10-27

US20220344227A1

Electricity

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR MOUNTING A SEMICONDUCTOR WITH FILM LAYER, AND SEMICONDUCTOR DEVICE

#4 | 2022-10-20

US20220332868A1

Chemistry; metallurgy

Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device

#5 | 2021-09-09

US20210277221A1

Chemistry; metallurgy

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device

#6 | 2021-05-20

US20210147680A1

Chemistry; metallurgy

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE

#7 | 2021-05-20

US20210147629A1

Chemistry; metallurgy

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device

#8 | 2019-10-03

US20190300678A1

Chemistry; metallurgy

Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer

#9 | 2019-09-12

US20190276657A1

Chemistry; metallurgy

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

#10 | 2018-08-09