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Inventor profile of:

Xing YU

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2025-10-09

Top Assignees for applications by Xing YU

The entities that hold a legal rights for patent applications filed by inventor YU Xing:

NCS Testing Technology CO., LTD 3 Beijing, China
Beijing Xiaomi Mobile Software Co., Ltd. 2 Beijing, China
BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD. 1 Suzhou, China
BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD. 1 Beijing, China
Central Iron and Steel Research Institute 1 Beijing, China
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States
BOE TECHNOLOGY GROUP CO., LTD. 1 Beijing, China
BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD. 1 Suzhou, Jiangsu, China
THE NCS TESTING TECHNOLOGY CO., LTD. 1 Beijing, China
NCS Testing Technology CO.,LTD 1 Beijing, BJ China
NCS Testing Technology CO.,LTD 1 Beijing, China

Recent patent applications by YU Xing

Xing YU from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-09

US20250316269A1

Physics

METHOD FOR PROCESSING CROSS-MODAL QUESTION ANSWERNING BASED ON LARGE MODEL, APPARATUS AND STORAGE MEDIUM

#2 | 2024-02-29

US20240066602A1

Performing operations; transporting

High-throughput 3D printing system for preparing multi-component, small sized samples

#3 | 2023-06-29

US20230205175A1

Physics

Integrated Research and Development System for High-throughput Preparation and Statistical Mapping Characterization of Materials

#4 | 2023-04-27

US20230130129A1

Electricity

Camera shooting program control method, electronic device, and storage medium

#5 | 2022-12-20

US17702712

Physics

Edge anti-false-touch method and apparatus, electronic device and computer-readable storage medium

#6 | 2022-06-30

US20220205922A1

Physics

Apparatus and method for preparing glow discharge sputtering samples for material microscopic characterization

#7 | 2021-11-18

US20210356369A1

Physics

HIGH THROUGHPUT STATISTICAL CHARACTERIZATION METHOD OF METAL MICROMECHANICAL PROPERTIES

#8 | 2020-09-17

US20200294760A1

Electricity

Apparatus and method for large-scale high throughput quantitative characterization and three-dimensional reconstruction of material structure

#9 | 2019-03-21

US20190086194A1

Physics

Full-field statistical and characterizing method of fluid micro-explored strain for alloy microstructure

#10 | 2016-09-15

US20160270169A1

Electricity

LED driver circuit and electronic device

#11 | 2012-05-03

US20120110475A1

Electricity

Dynamically Controlling the Process of an Electronic Meeting

InventorID:

1653115 ⎘