Berlin
Germany
8
2024-10-10
The entities that hold a legal rights for patent applications filed by inventor REENTS Bert:
Bert REENTS from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER
#2 | 2022-09-22Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
#3 | 2022-09-01Method of preparing a high density interconnect printed circuit board including microvias filled with copper
#4 | 2016-09-15Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
#5 | 2009-12-10Electrolytic method for filling holes and cavities with metals
#6 | 2009-09-24Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
#7 | 2006-07-13Method of electroplating a workpiece having high-aspect ratio holes
#8 | 2006-04-13Device and method for electrolytically treating an at least superficially electrically conducting work piece
1653161 ⎘