Inventor profile of:

Takashi Oda

City:

Ibaraki-shi

Country:

Japan

Published Applications:

19

Last publication date:

2023-09-07

Top Assignees for applications by Takashi Oda

The entities that hold a legal rights for patent applications filed by inventor Oda Takashi:

Recent patent applications by Oda Takashi

Takashi Oda from Ibaraki-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-09-07
US20230280554A1
Physics

OPTO-ELECTRIC HYBRID BOARD, OPTICAL COMMUNICATION MODULE USING SAME, AND OPTICAL ELEMENT INSPECTION METHOD

#2 | 2023-08-17
US20230258893A1
Physics

OPTO-ELECTRIC HYBRID BOARD

#3 | 2023-08-10
US20230254973A1
Electricity

OPTICAL COMMUNICATION MODULE SUBSTRATE

#4 | 2014-09-04
US20140249269A1
Chemistry; metallurgy

THERMALLY-DETACHABLE SHEET

#5 | 2013-10-31
US20130288428A1
Electricity

Method for producing semiconductor device

#6 | 2013-08-22
US20130217187A1
Chemistry; metallurgy

Manufacturing semiconductor device with film for forming protective layer

#7 | 2013-06-20
US20130157419A1
Electricity

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#8 | 2013-03-28
US20130078770A1
Electricity

Method for producing semiconductor device

#9 | 2013-03-28
US20130078769A1
Electricity

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

#10 | 2012-12-27
US20120329250A1
Electricity

Method of manufacturing semiconductor device

#11 | 2012-12-27
US20120326280A1
Electricity

Laminated film and use thereof

#12 | 2012-08-16
US20120208350A1
Electricity

Method of manufacturing semiconductor device having a bumped wafer and protective layer

#13 | 2012-08-16
US20120208009A1
Chemistry; metallurgy

FILM FOR FORMING PROTECTIVE LAYER

#14 | 2012-08-16
US20120205820A1
Electricity

ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE

#15 | 2011-06-16
US20110143501A1
Electricity

Manufacturing method for semiconductor device

#16 | 2011-06-02
US20110127657A1
Electricity

Wiring circuit structure and manufacturing method for semiconductor device using the structure

#17 | 2010-09-30
US20100248428A1
Electricity

Method of manufacturing a semiconductor device by lamination

#18 | 2010-06-17
US20100151629A1
Electricity

Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element

#19 | 2010-04-15
US20100092714A1
Chemistry; metallurgy

Pressure-Sensitive Adhesive Tape

InventorID:

166364 ⎘