San Jose, California
United States
30
2019-04-04
The entities that hold a legal rights for patent applications filed by inventor Epler John E.:
John E. Epler from San Jose, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Light emitting device including porous semiconductor
#2 | 2016-09-29III-nitride light emitting device including porous semiconductor
#3 | 2012-09-20Color control by alteration of wavelenght converting element
#4 | 2012-09-06Method of bonding a semiconductor device using a compliant bonding structure
#5 | 2012-08-30Semiconductor light emitting device with a contact formed on a textured surface
#6 | 2012-08-09Contact for a semiconductor light emitting device
#7 | 2012-07-26Contact for a semiconductor light emitting device
#8 | 2012-03-29Semiconductor light emitting device with a contact formed on a textured surface
#9 | 2012-02-23Contact for a semiconductor light emitting device
#10 | 2012-02-02Series connected flip chip LEDs with growth substrate removed
#11 | 2011-08-11III-nitride light emitting device including porous semiconductor
#12 | 2011-06-09Color control by alteration of wavelength converting element
#13 | 2011-05-26III-V light emitting device with thin n-type region
#14 | 2011-05-19Compliant bonding structures for semiconductor devices
#15 | 2011-01-27Contact for a semiconductor light emitting device
#16 | 2011-01-27THIN-FILM FLIP-CHIP SERIES CONNECTED LEDS
#17 | 2010-12-30CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
#18 | 2010-12-23Semiconductor light emitting device with a contact formed on a textured surface
#19 | 2010-09-09Method of bonding a semiconductor device using a compliant bonding structure
#20 | 2010-09-09SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING IN-PLANE LIGHT EMITTING LAYERS
#21 | 2010-09-09Complaint bonding structures for semiconductor devices
#22 | 2010-05-06Series connected flip chip LEDs with growth substrate removed
#23 | 2010-02-18Package-integrated thin film LED
#24 | 2010-02-04Controlling edge emission in package-free LED die
#25 | 2009-07-09CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
#26 | 2009-06-04III-nitride light emitting device including porous semiconductor layer
#27 | 2009-03-19Color control by alteration of wavelength converting element
#28 | 2009-02-19Photonic crystal light emitting device
#29 | 2008-12-25Low profile side emitting LED with window layer and phosphor layer
#30 | 2006-12-14Method of removing the growth substrate of a semiconductor light emitting device
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