Barcelona
Spain
10
2022-05-12
The entities that hold a legal rights for patent applications filed by inventor Martorell Ferran:
Ferran Martorell from Barcelona, ES has applied for patents for these inventions. The list has both pending applications and granted patents:
High density low power interconnect using 3D die stacking
#2 | 2021-04-15High density low power interconnect using 3D die stacking
#3 | 2016-12-22Scaling of Integrated Circuit Design Including High-Level Logic Components
#4 | 2016-10-06Integrated circuit design optimization
#5 | 2016-10-06Scaling of integrated circuit design including high-level logic components
#6 | 2016-10-06Integrated circuit design scaling for recommending design point
#7 | 2016-10-06Scaling of integrated circuit design including logic and memory components
#8 | 2016-10-06Scaling memory components of integrated circuit design
#9 | 2016-10-06Scaling logic components of integrated circuit design
#10 | 2011-08-25Asynchronous scheme for clock domain crossing
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