Poughkeepsie, New York
United States
237
2021-12-30
The entities that hold a legal rights for patent applications filed by inventor Schmidt Roger R.:
Roger R. Schmidt from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Liquid cooling for medical devices
#2 | 2020-06-04Effectiveness-weighted control of cooling system components
#3 | 2020-01-09Fuel vaporization using data center waste heat
#4 | 2019-05-23Composite heat sink structures
#5 | 2019-05-16Protective cover assembly for air-moving assembly
#6 | 2018-12-27PROTECTIVE COVER ASSEMBLY FOR AIR-MOVING ASSEMBLY
#7 | 2018-11-15Fuel vaporization using data center waste heat
#8 | 2018-10-11Effectiveness-weighted control of cooling system components
#9 | 2018-04-05Protective louver assembly for air-moving assembly
#10 | 2018-03-22Composite heat sink structures
#11 | 2018-03-15Thermoelectric-enhanced, inlet air-cooled thermal conductors
#12 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#13 | 2017-05-04Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
#14 | 2017-04-27Determining a time for corrective action in a data center
#15 | 2017-02-16Thermoelectric-enhanced, inlet air-cooled thermal conductors
#16 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#17 | 2017-02-16Liquid-cooled, composite heat sink assemblies
#18 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#19 | 2017-01-12Thermoelectric-enhanced, inlet air cooling for an electronics rack
#20 | 2016-12-15Fuel vaporization using data center waste heat
#21 | 2016-12-15Fuel vaporization using data center waste heat
#22 | 2016-11-22Thermoelectric-enhanced, inlet air-cooled thermal conductors
#23 | 2016-06-16Protective cover assembly for air-moving assembly
#24 | 2016-05-19Fuel vaporization using data center waste heat
#25 | 2016-05-19Composite heat sink structures
#26 | 2016-05-19Liquid-cooled heat sink assemblies
#27 | 2016-05-19Liquid-cooled heat sink assemblies
#28 | 2016-05-19Fuel vaporization using data center waste heat
#29 | 2016-05-19Composite heat sink structures
#30 | 2016-03-31Interlock assembly for air-moving assembly
#31 | 2016-03-31Interlock assembly for air-moving assembly
#32 | 2016-03-31Protective louver assembly for air-moving assembly
#33 | 2016-03-31Locking louver assembly for air-moving assembly
#34 | 2016-03-31Protective louver assembly for air-moving assembly
#35 | 2016-03-31Locking louver assembly for air-moving assembly
#36 | 2016-03-24Effectiveness-weighted control of cooling system components
#37 | 2015-12-10Fabricating a liquid-cooling apparatus with coolant filter
#38 | 2015-12-10Coolant-cooled heat sink configured for accelerating coolant flow
#39 | 2015-12-10Field-replaceable bank of immersion-cooled electronic components
#40 | 2015-12-03Pump-enhanced, immersion-cooling of electronic compnent(s)
#41 | 2015-06-18Liquid-cooling apparatus with integrated coolant filter
#42 | 2015-04-30Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader
#43 | 2015-04-23Pump-enhanced, immersion-cooling of electronic component(s)
#44 | 2015-04-23Direct coolant contact vapor condensing
#45 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
#46 | 2015-04-23Field-replaceable bank of immersion-cooled electronic components
#47 | 2015-04-23Coolant-cooled heat sink configured for accelerating coolant flow
#48 | 2014-08-21Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)
#49 | 2014-06-12Effectiveness-weighted control method for a cooling system
#50 | 2014-06-12Effectiveness-weighted control of cooling system components
#51 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#52 | 2014-06-12Thermostat-controlled coolant flow within a heat sink
#53 | 2014-05-29Immersion-cooled and conduction-cooled method for electronic system
#54 | 2014-05-29Immersion-cooled and conduction-cooled electronic system
#55 | 2014-05-15Air-cooling and vapor-condensing door assembly
#56 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#57 | 2014-05-15Air-cooling and vapor-condensing door assembly
#58 | 2014-05-15Inlet-air-cooling door assembly for an electronics rack
#59 | 2014-05-08Separate control of coolant flow through coolant circuits
#60 | 2014-05-08Separate control of coolant flow through coolant circuits
#61 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#62 | 2014-05-08Coolant-conditioning unit with automated control of coolant flow valves
#63 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#64 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#65 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#66 | 2014-05-08Ground-based heat sink facilitating electronic system cooling
#67 | 2014-05-08Sectioned manifolds facilitating pumped immersion-cooling of electronic components
#68 | 2014-05-08Pump-enhanced, sub-cooling of immersion-cooling fluid
#69 | 2014-05-01Energy efficient solar powered high voltage direct current based data center
#70 | 2014-05-01Energy efficient solar powered high voltage direct current based data center
#71 | 2014-04-17INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD
#72 | 2014-04-17INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD
#73 | 2014-04-03Method for controlling airflow of directional flow perforated tile
#74 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
#75 | 2014-03-27Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#76 | 2014-03-27Immersion-cooling of selected electronic component(s) mounted to printed circuit board
#77 | 2014-03-27Wicking and coupling element(s) facilitating evaporative cooling of component(s)
#78 | 2014-03-20Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
#79 | 2014-03-20Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
#80 | 2014-03-13Coolant drip facilitating partial immersion-cooling of electronic components
#81 | 2014-03-13Vapor condenser with three-dimensional folded structure
#82 | 2014-03-13Thermoelectric-enhanced air and liquid cooling of an electronic system
#83 | 2014-03-13Thermoelectric-enhanced air and liquid cooling of an electronic system
#84 | 2014-03-13Vapor condenser with three-dimensional folded structure
#85 | 2014-03-06Techniques for data center cooling
#86 | 2014-02-13Multi-rack, door-mounted heat exchanger
#87 | 2014-02-13MULTI-RACK, DOOR-MOUNTED HEAT EXCHANGER
#88 | 2014-02-13Multi-rack, door-mounted heat exchanger
#89 | 2014-02-13Multi-rack, door-mounted heat exchanger
#90 | 2013-12-26Controlled cooling of an electronic system based on projected conditions
#91 | 2013-12-26Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
#92 | 2013-12-26Controlled cooling of an electronic system based on projected conditions
#93 | 2013-12-26Controlled cooling of an electronic system for reduced energy consumption
#94 | 2013-12-26Controlled cooling of an electronic system for reduced energy consumption
#95 | 2013-11-14Liquid cooled data center with alternating coolant supply lines
#96 | 2013-10-10Structural configuration of a heat exchanger door for an electronics rack
#97 | 2013-10-10Structural configuration of a heat exchanger door for an electronics rack
#98 | 2013-10-10Process for optimizing a heat exchanger configuration
#99 | 2013-10-10Heat exchanger door for an electronics rack
#100 | 2013-10-10Process for optimizing a heat exchanger configuration
1706 ⎘