Jack E. Murray

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2024-10-10

Top Assignees for applications by Jack E. Murray

The entities that hold a legal rights for patent applications filed by inventor Murray Jack E.:

Micron Technology, Inc. 7 Boise, ID United States

Recent patent applications by Murray Jack E.

Jack E. Murray from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-10

US20240339390A1

Electricity

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

#2 | 2022-09-15

US20220293506A1

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

#3 | 2022-01-27

US20220028771A1

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

#4 | 2019-11-28

US20190363044A1

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

#5 | 2019-04-11

US20190109081A1

Electricity

Methods of processing semiconductor devices

#6 | 2019-04-11

US20190109080A1

Electricity

Electronic devices having tapered edge walls

#7 | 2019-04-11

US20190109079A1

Electricity

Methods of processing semiconductor devices

#8 | 2018-11-01

US20180315689A1

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

#9 | 2016-11-24

US20160343690A1

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

#10 | 2016-08-16

US14714599

Electricity

Package-on-package semiconductor assemblies and methods of manufacturing the same

InventorID:

1720179 ⎘