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Inventor profile of:

Bob Martin

City:

Eagan, Minnesota

Country:

United States

Published Applications:

1

Last publication date:

2016-12-01

Recent patent applications by Martin Bob

Bob Martin from Eagan, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-12-01

US20160351436A1

LOW TEMPERATURE WAFER BONDING

InventorID:

1727173 ⎘