MING-JUN YI

City:

Shenzhen

Country:

China

Published Applications:

Last publication date:

2018-10-04

Top Assignees for applications by MING-JUN YI

The entities that hold a legal rights for patent applications filed by inventor YI MING-JUN:

MING-JUN YI from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Apparatus for disassembling electronic component from circuit board

Apparatus for disassembling electronic component from circuit board

InventorID:

1728731 ⎘