Meridian, Idaho
United States
24
2024-07-04
The entities that hold a legal rights for patent applications filed by inventor Hacker Jonathan S.:
Jonathan S. Hacker from Meridian, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#2 | 2024-05-30UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY
#3 | 2023-04-06Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
#4 | 2021-08-19Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
#5 | 2021-03-11Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
#6 | 2021-02-11Inductive testing probe apparatus for testing semiconductor die and related systems and methods
#7 | 2020-11-26Die features for self-alignment during die bonding
#8 | 2020-07-02Systems and methods for forming semiconductor cutting/trimming blades
#9 | 2020-03-12Die features for self-alignment during die bonding
#10 | 2019-12-19Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
#11 | 2019-11-07Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
#12 | 2019-10-10Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
#13 | 2019-06-27Temporary carrier debond initiation, and associated systems and methods
#14 | 2019-06-20Semiconductor devices having discretely located passivation material, and associated systems and methods
#15 | 2019-06-13Inductive testing probe apparatus for testing semiconductor die and related systems and methods
#16 | 2019-05-23Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
#17 | 2019-05-23Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
#18 | 2019-03-21Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
#19 | 2019-02-14Semiconductor devices having discretely located passivation material, and associated systems and methods
#20 | 2018-06-21Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
#21 | 2018-06-19Semiconductor devices having discretely located passivation material, and associated systems and methods
#22 | 2018-02-27Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
#23 | 2018-02-01Methods of manufacturing multi-die semiconductor device packages and related assemblies
#24 | 2016-12-08Methods of manufacturing multi-die semiconductor device packages and related assemblies
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