Inventor profile of:

Thomas A. KOES

City:

Riverside, California

Country:

United States

Published Applications:

10

Last publication date:

2025-08-28

Top Assignees for applications by Thomas A. KOES

The entities that hold a legal rights for patent applications filed by inventor KOES Thomas A.:

Recent patent applications by KOES Thomas A.

Thomas A. KOES from Riverside, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-08-28
US20250269627A1
Performing operations; transporting

LAMINATE

#2 | 2025-03-06
US20250075011A1
Chemistry; metallurgy

PHOTOCURABLE COMPOSITIONS FOR STEREOLITHOGRAPHY, METHOD OF FORMING THE COMPOSITIONS, STEREOLITHOGRAPHY METHODS USING THE COMPOSITIONS, POLYMER COMPONENTS FORMED BY THE STEREOLITHOGRAPHY METHODS, AND A DEVICE INCLUDING THE POLYMER COMPONENTS

#3 | 2024-01-04
US20240002554A1
Chemistry; metallurgy

Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components

#4 | 2023-08-03
US20230242709A1
Chemistry; metallurgy

THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND

#5 | 2023-02-16
US20230052719A1
Electricity

THERMOSETTING THERMALLY CONDUCTIVE DIELECTRIC COMPOSITE

#6 | 2022-09-22
US20220298270A1
Chemistry; metallurgy

Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components

#7 | 2020-12-03
US20200377628A1
Chemistry; metallurgy

Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components

#8 | 2020-11-26
US20200369855A1
Chemistry; metallurgy

LOW LOSS, COMPOSITE LAYER AND A COMPOSITION FOR FORMING THE SAME

#9 | 2020-08-27
US20200270413A1
Chemistry; metallurgy

LOW LOSS DIELECTRIC COMPOSITE COMPRISING A HYDROPHOBIZED FUSED SILICA

#10 | 2016-12-15
US20160362527A1
Chemistry; metallurgy

Circuit materials and articles formed therefrom

InventorID:

1736693 ⎘