Inventor profile of:

Tetsuya UEDA

City:

Osaka

Country:

Japan

Published Applications:

15

Last publication date:

2016-12-22

Top Assignees for applications by Tetsuya UEDA

The entities that hold a legal rights for patent applications filed by inventor UEDA Tetsuya:

Recent patent applications by UEDA Tetsuya

Tetsuya UEDA from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-12-22
US20160373160A1
Electricity

Non-reciprocal transmission apparatus with different backward and forward propagation constants, provided for circularly polarized wave antenna apparatus

#2 | 2011-01-27
US20110021017A1
Electricity

Method for fabricating semiconductor device and semiconductor device

#3 | 2010-09-16
US20100230820A1
Electricity

Method for fabricating semiconductor device and semiconductor device

#4 | 2010-02-18
US20100041229A1
Electricity

Method and fabricating semiconductor device and semiconductor device

#5 | 2009-03-26
US20090079079A1
Electricity

Semiconductor device with a low dielectric constant film between lower interconnections

#6 | 2008-07-24
US20080174018A1
Electricity

Semiconductor device and method for fabricating the same

#7 | 2008-07-03
US20080158775A1
Electricity

Semiconductor device and method for fabricating the same

#8 | 2006-04-27
US20060088975A1
Electricity

Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gap

#9 | 2006-03-16
US20060054960A1
Electricity

Semiconductor device and method for fabricating the same

#10 | 2005-07-19
US10328175
-

Method for forming wiring structure

#11 | 2005-04-19
US10328170
-

Method for forming wiring structure

#12 | 2005-04-07
US20050075025A1
Performing operations; transporting

Carpet for vehicles and method for manufacturing the same

#13 | 2005-03-17
US20050059231A1
Electricity

Semiconductor device and method for fabricating the same

#14 | 2005-03-10
US20050054195A1
Electricity

Semiconductor device and method for fabricating the same

#15 | 2005-02-22
US10328178
-

Method for forming wiring structure

InventorID:

1746056 ⎘