Kuo-Wei Tseng

City:

Hsinchu County

Country:

Taiwan

Published Applications:

Last publication date:

2024-10-17

Top Assignees for applications by Kuo-Wei Tseng

The entities that hold a legal rights for patent applications filed by inventor Tseng Kuo-Wei:

SITRONIX TECHNOLOGY CORP. 3 HSINCHU COUNTY, Taiwan

Recent patent applications by Tseng Kuo-Wei

Kuo-Wei Tseng from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-17

US20240347491A1

Electricity

BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

#2 | 2020-10-22

US20200335474A1

Electricity

Chip Packaging Structure and Related Inner Lead Bonding Method

#3 | 2018-04-26

US20180114769A1

Electricity

Chip Packaging Structure and Related Inner Lead Bonding Method

#4 | 2017-11-30

US20170345784A1

Electricity

Manufacturing method for electronic element

#5 | 2016-12-29

US20160379949A1

Electricity

Electronic element and manufacturing method

InventorID:

1751848 ⎘