Katonah, New York
United States
33
2019-01-17
The entities that hold a legal rights for patent applications filed by inventor DOANY FUAD E.:
FUAD E. DOANY from Katonah, US has applied for patents for these inventions. The list has both pending applications and granted patents:
High-density, fail-in-place switches for computer and data networks
#2 | 2018-07-19Tag with tunable retro-reflectors
#3 | 2017-11-14Tag with tunable retro-reflectors
#4 | 2017-07-13Polarization rotator for silicon photonics
#5 | 2017-06-08Damage-free self-limiting through-substrate laser ablation
#6 | 2017-06-01High-density, fail-in-place switches for computer and data networks
#7 | 2017-01-05Lens array optical coupling to photonic chip
#8 | 2016-09-15Realizing coarse wavelength-division multiplexing using standard multimode optical fibers
#9 | 2016-09-15Realizing coarse wavelength-division multiplexing using standard multimode optical fibers
#10 | 2016-09-15Controlling fragmentation of chemically strengthened glass
#11 | 2016-05-19Controlling fragmentation of chemically strengthened glass
#12 | 2016-05-12Damage-free self-limiting through-substrate laser ablation
#13 | 2016-03-31Polarization-independent grating coupler for silicon on insulator
#14 | 2015-12-03Optical waveguide structure with waveguide coupler to facilitate off-chip coupling
#15 | 2015-10-08High-density, fail-in-place switches for computer and data networks
#16 | 2015-03-05Optical waveguide structure with waveguide coupler to facilitate off-chip coupling
#17 | 2014-10-16Grating edge coupler and method of forming same
#18 | 2014-10-16Grating edge coupler and method of forming same
#19 | 2013-11-21Parallel optical transceiver module
#20 | 2013-10-17Differential amplifier stage with integrated offset cancellation circuit
#21 | 2013-07-18Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
#22 | 2013-06-06Parallel optical transceiver module
#23 | 2013-04-04Lens array optical coupling to photonic chip
#24 | 2012-12-13Differential amplifier stage with integrated offset cancellation circuit
#25 | 2012-08-16FLIP-CHIP PACKAGING FOR DENSE HYBRID INTEGRATION OF ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS
#26 | 2012-06-28Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process
#27 | 2012-01-05Differential amplifier stage with integrated offset cancellation circuit
#28 | 2012-01-05Fabricating a semiconductor chip with backside optical vias
#29 | 2008-09-25DUV laser annealing and stabilization of SiCOH films
#30 | 2007-12-13DUV laser annealing and stabilization of SiCOH films
#31 | 2006-08-29Stability of ion beam generated alignment layers by surface modification
#32 | 2006-04-25Means of seeding and metallizing polyimide
#33 | 2006-02-23DUV laser annealing and stabilization of SiCOH films
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