Inventor profile of:

Eric G. Larson

City:

Lake Elmo, Minnesota

Country:

United States

Published Applications:

22

Last publication date:

2025-04-24

Top Assignees for applications by Eric G. Larson

The entities that hold a legal rights for patent applications filed by inventor Larson Eric G.:

Recent patent applications by Larson Eric G.

Eric G. Larson from Lake Elmo, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-04-24
US20250129204A1
Chemistry; metallurgy

COLOR STABLE EPOXY COMPOSITIONS

#2 | 2023-11-30
US20230383114A1
Chemistry; metallurgy

Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods

#3 | 2023-08-24
US20230265279A1
Chemistry; metallurgy

Color Stable Epoxy Compositions

#4 | 2020-09-10
US20200283619A1
Chemistry; metallurgy

Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

#5 | 2020-07-02
US20200208020A1
Chemistry; metallurgy

Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method

#6 | 2015-11-19
US20150329740A1
Chemistry; metallurgy

Semiconductor package resin composition and usage method thereof

#7 | 2015-02-05
US20150034238A1
Electricity

LAMINATE BODY, METHOD, AND MATERIALS FOR TEMPORARY SUBSTRATE SUPPORT AND SUPPORT SEPARATION

#8 | 2015-01-15
US20150017434A1
Performing operations; transporting

APPARATUS, HYBRID LAMINATED BODY, METHOD, AND MATERIALS FOR TEMPORARY SUBSTRATE SUPPORT

#9 | 2014-08-07
US20140217622A1
Electricity

Semiconductor package resin composition and usage method thereof

#10 | 2013-11-07
US20130295311A1
Performing operations; transporting

Curable composition, articles comprising the curable composition, and method of making the same

#11 | 2013-04-04
US20130084459A1
Chemistry; metallurgy

LOW PEEL ADHESIVE

#12 | 2012-02-09
US20120034426A1
Electricity

ARTICLE AND METHOD FOR BONDING SUBSTRATES WITH LARGE TOPOGRAPHIES

#13 | 2011-03-17
US20110064948A1
Electricity

Dicing tape and die attach adhesive with patterned backing

#14 | 2010-03-04
US20100056725A1
Electricity

Dicing and die attach adhesive

#15 | 2009-09-10
US20090227089A1
Electricity

Dicing tape and die attach adhesive with patterned backing

#16 | 2009-06-18
US20090155596A1
Chemistry; metallurgy

NOZZLE SEALING COMPOSITION AND METHOD

#17 | 2009-04-02
US20090087591A1
Electricity

Low temperature bonding electronic adhesives

#18 | 2009-01-15
US20090017248A1
Electricity

LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY

#19 | 2008-01-24
US20080020157A1
Electricity

Anisotropic conductive adhesives

#20 | 2007-05-24
US20070116961A1
Chemistry; metallurgy

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITIONS

#21 | 2007-03-01
US20070044384A1
Performing operations; transporting

Abrasive article and method

#22 | 2006-05-25
US20060110600A1
Electricity

Anisotropic conductive adhesive composition

InventorID:

176801 ⎘