Mabalacat
Philippines
7
2025-09-18
The entities that hold a legal rights for patent applications filed by inventor Baello James Raymond Maliclic:
James Raymond Maliclic Baello from Mabalacat, PH has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
#2 | 2025-01-16SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
#3 | 2022-12-15Semiconductor package with metal column mold barrier
#4 | 2022-04-21Semiconductor device assembly with pre-reflowed solder
#5 | 2021-07-01Semiconductor package with flip chip solder joint capsules
#6 | 2021-06-17Electronic device topside cooling
#7 | 2017-01-12Semiconductor devices having metal bumps with flange
1770099 ⎘