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Inventor profile of:

David B. James

City:

Newark, Delaware

Country:

United States

Published Applications:

Last publication date:

2015-10-01

Top Assignees for applications by David B. James

The entities that hold a legal rights for patent applications filed by inventor James David B.:

Rohm and Haas Electronic Materials CMP Holdings, Inc. 21 Newark, DE United States
DOW GLOBAL TECHNOLOGIES LLC 8 Midland, MI United States
Rohm and Haas Electronic Materials CMP Holdings, INC 4 Wilmington, DE United States
Rohm and Haas Electronics Materials CMP Holdings, Inc. 2 Newark, DE United States
Rohm and Haas Electronic Materials CMP Inc. 1 Newark, DE United States
Rohm and Haas Electronic Materials CMP Holdings, Inc. 1 Newark, Germany
NITTA HAAS INCORPORATED 1 Osaka, Japan
Rohm and Haas Electric Materials CMP Holdings, Inc. 1 Wilmington, DE United States
Roham and Haas Electronic Materials CMP Holdings Inc 1 Newark, DE United States

Recent patent applications by James David B.

David B. James from Newark, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-10-01

US20150273652A1

Performing operations; transporting

Chemical mechanical polishing pad with polishing layer and window

#2 | 2015-06-23

US14228744

Electricity

Soft and conditionable chemical mechanical polishing pad with window

#3 | 2015-03-17

US14062060

Electricity

Method for chemical mechanical polishing silicon wafers

#4 | 2015-03-05

US20150059254A1

Performing operations; transporting

POLYURETHANE POLISHING PAD

#5 | 2014-12-04

US20140357170A1

Performing operations; transporting

Soft and conditionable chemical mechanical window polishing pad

#6 | 2014-12-04

US20140357169A1

Performing operations; transporting

Soft and conditionable chemical mechanical polishing pad stack

#7 | 2014-12-04

US20140357163A1

Performing operations; transporting

Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer

#8 | 2014-09-11

US20140256232A1

Performing operations; transporting

Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad

#9 | 2014-09-11

US20140256231A1

Performing operations; transporting

Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window

#10 | 2014-09-11

US20140256226A1

Performing operations; transporting

Broad spectrum, endpoint detection window chemical mechanical polishing pad and polishing method

#11 | 2014-09-11

US20140256225A1

Performing operations; transporting

Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith

#12 | 2014-05-01

US20140120809A1

Performing operations; transporting

Soft and conditionable chemical mechanical polishing pad

#13 | 2013-11-14

US20130303061A1

Performing operations; transporting

Alkaline-earth metal oxide-polymeric polishing pad

#14 | 2013-11-14

US20130298473A1

Performing operations; transporting

Hollow polymeric-alkaline earth metal oxide composite

#15 | 2013-11-14

US20130298472A1

Performing operations; transporting

Forming alkaline-earth metal oxide polishing pad

#16 | 2013-04-04

US20130084702A1

Chemistry; metallurgy

Acrylate polyurethane chemical mechanical polishing layer

#17 | 2012-07-05

US20120171940A1

Performing operations; transporting

Dual-pore structure polishing pad

#18 | 2011-03-31

US20110076928A1

Performing operations; transporting

Dual-pore structure polishing pad

#19 | 2010-01-07

US20100000877A1

Performing operations; transporting

Method for electrochemical mechanical polishing

#20 | 2008-06-26

US20080153395A1

Performing operations; transporting

Chemical mechanical polishing pad

#21 | 2008-05-13

US11644478

Elastomer-modified chemical mechanical polishing pad

#22 | 2007-06-21

US20070141312A1

Performing operations; transporting

Multilayered polishing pads having improved defectivity and methods of manufacture

#23 | 2006-10-12

US20060228439A1

Performing operations; transporting

Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad

#24 | 2006-10-12

US20060226568A1

Chemistry; metallurgy

Method for forming a porous reaction injection molded chemical mechanical polishing pad

#25 | 2006-10-12

US20060226567A1

Performing operations; transporting

Method for forming a porous polishing pad

#26 | 2006-09-14

US20060202384A1

Performing operations; transporting

Water-based polishing pads and methods of manufacture

#27 | 2005-12-01

US20050263406A1

Performing operations; transporting

Polishing pad for electrochemical mechanical polishing

#28 | 2005-04-14

US20050079806A1

Performing operations; transporting

Polishing pad

#29 | 2005-03-22

US10659889

Polishing pads and methods relating thereto

#30 | 2005-03-01

US9608537

Polishing pads for chemical mechanical planarization

#31 | 2005-02-01

US10652175

Polishing pad for electrochemical mechanical polishing

#32 | 2005-01-27

US20050020082A1

Performing operations; transporting

Polishing pads for chemical mechanical planarization

#33 | 2005-01-18

US10660250

Polishing pads and methods relating thereto

InventorID:

177333 ⎘