Inventor profile of:

Thomas Werner

City:

Reichenberg

Country:

Germany

Published Applications:

19

Last publication date:

2013-04-04

Top Assignees for applications by Thomas Werner

The entities that hold a legal rights for patent applications filed by inventor Werner Thomas:

Recent patent applications by Werner Thomas

Thomas Werner from Reichenberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-04-04
US20130084703A1
Electricity

Restricted stress regions formed in the contact level of a semiconductor device

#2 | 2012-04-19
US20120091535A1
Electricity

Method and Semiconductor Device Comprising a Protection Layer for Reducing Stress Relaxation in a Dual Stress Liner Approach

#3 | 2012-01-26
US20120021581A1
Electricity

SELF-ALIGNED CONTACT STRUCTURE LATERALLY ENCLOSED BY AN ISOLATION STRUCTURE OF A SEMICONDUCTOR DEVICE

#4 | 2011-05-05
US20110101426A1
Electricity

Method for making semiconductor device comprising replacement gate electrode structures with an enhanced diffusion barrier

#5 | 2010-06-03
US20100133621A1
Electricity

RESTRICTED STRESS REGIONS FORMED IN THE CONTACT LEVEL OF A SEMICONDUCTOR DEVICE

#6 | 2009-12-03
US20090294809A1
Electricity

REDUCTION OF METAL SILICIDE DIFFUSION IN A SEMICONDUCTOR DEVICE BY PROTECTING SIDEWALLS OF AN ACTIVE REGION

#7 | 2009-08-06
US20090194845A1
Electricity

Semiconductor device comprising a capacitor in the metallization system and a method of forming the capacitor

#8 | 2009-08-06
US20090194825A1
Electricity

SELF-ALIGNED CONTACT STRUCTURE IN A SEMICONDUCTOR DEVICE

#9 | 2009-06-04
US20090140348A1
Electricity

Method and a semiconductor device comprising a protection layer for reducing stress relaxation in a dual stress liner approach

#10 | 2008-06-05
US20080131796A1
Electricity

Method and test structure for estimating focus settings in a lithography process based on CD measurements

#11 | 2008-06-05
US20080131257A1
Electricity

SYSTEM AND METHOD FOR REDUCING COLLATERAL TRANSPORT-INDUCED DAMAGE DURING MICROSTRUCTURE PROCESSING

#12 | 2008-05-01
US20080099761A1
Electricity

Test structure for OPC-related shorts between lines in a semiconductor device

#13 | 2008-04-03
US20080081481A1
Electricity

Method for reducing resist poisoning during patterning of stressed nitrogen-containing layers in a semiconductor device

#14 | 2008-03-06
US20080054314A1
Electricity

Field effect transistor having a stressed contact etch stop layer with reduced conformality

#15 | 2008-01-17
US20080012073A1
Electricity

Test structure for determining characteristics of semiconductor alloys in SOI transistors by x-ray diffraction

#16 | 2008-01-03
US20080003826A1
Electricity

METHOD FOR INCREASING THE PLANARITY OF A SURFACE TOPOGRAPHY IN A MICROSTRUCTURE

#17 | 2007-07-05
US20070155121A1
Electricity

Technique for forming an isolation trench as a stress source for strain engineering

#18 | 2007-05-03
US20070099414A1
Electricity

Semiconductor device comprising a contact structure based on copper and tungsten

#19 | 2006-08-03
US20060172525A1
Electricity

Technique for enhancing process flexibility during the formation of vias and trenches in low-k interlayer dielectrics

InventorID:

177336 ⎘