Reichenberg
Germany
19
2013-04-04
The entities that hold a legal rights for patent applications filed by inventor Werner Thomas:
Thomas Werner from Reichenberg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Restricted stress regions formed in the contact level of a semiconductor device
#2 | 2012-04-19Method and Semiconductor Device Comprising a Protection Layer for Reducing Stress Relaxation in a Dual Stress Liner Approach
#3 | 2012-01-26SELF-ALIGNED CONTACT STRUCTURE LATERALLY ENCLOSED BY AN ISOLATION STRUCTURE OF A SEMICONDUCTOR DEVICE
#4 | 2011-05-05Method for making semiconductor device comprising replacement gate electrode structures with an enhanced diffusion barrier
#5 | 2010-06-03RESTRICTED STRESS REGIONS FORMED IN THE CONTACT LEVEL OF A SEMICONDUCTOR DEVICE
#6 | 2009-12-03REDUCTION OF METAL SILICIDE DIFFUSION IN A SEMICONDUCTOR DEVICE BY PROTECTING SIDEWALLS OF AN ACTIVE REGION
#7 | 2009-08-06Semiconductor device comprising a capacitor in the metallization system and a method of forming the capacitor
#8 | 2009-08-06SELF-ALIGNED CONTACT STRUCTURE IN A SEMICONDUCTOR DEVICE
#9 | 2009-06-04Method and a semiconductor device comprising a protection layer for reducing stress relaxation in a dual stress liner approach
#10 | 2008-06-05Method and test structure for estimating focus settings in a lithography process based on CD measurements
#11 | 2008-06-05SYSTEM AND METHOD FOR REDUCING COLLATERAL TRANSPORT-INDUCED DAMAGE DURING MICROSTRUCTURE PROCESSING
#12 | 2008-05-01Test structure for OPC-related shorts between lines in a semiconductor device
#13 | 2008-04-03Method for reducing resist poisoning during patterning of stressed nitrogen-containing layers in a semiconductor device
#14 | 2008-03-06Field effect transistor having a stressed contact etch stop layer with reduced conformality
#15 | 2008-01-17Test structure for determining characteristics of semiconductor alloys in SOI transistors by x-ray diffraction
#16 | 2008-01-03METHOD FOR INCREASING THE PLANARITY OF A SURFACE TOPOGRAPHY IN A MICROSTRUCTURE
#17 | 2007-07-05Technique for forming an isolation trench as a stress source for strain engineering
#18 | 2007-05-03Semiconductor device comprising a contact structure based on copper and tungsten
#19 | 2006-08-03Technique for enhancing process flexibility during the formation of vias and trenches in low-k interlayer dielectrics
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