Seoul
South Korea
7
2019-11-21
The entities that hold a legal rights for patent applications filed by inventor KO Eun:
Eun KO from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Stacked semiconductor package having mold vias and method for manufacturing the same
#2 | 2018-11-15Stacked semiconductor package having mold vias and method for manufacturing the same
#3 | 2017-11-02Semiconductor chip flexibly applied to various routing structures and semiconductor chip module using the same
#4 | 2017-03-23Semiconductor package embedded with a plurality of chips
#5 | 2017-03-16Memory device and electronic apparatus including the same
#6 | 2017-03-02Semiconductor package embedded with plurality of chips and method of manufacturing the same
#7 | 2017-01-19Stacked semiconductor package including reconfigurable package units
1775955 ⎘