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Inventor profile of:

Erich Thallner

City:

Scharding

Country:

Austria

Published Applications:

3

Last publication date:

2017-02-02

Recent patent applications by Thallner Erich

Erich Thallner from Scharding, AT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-02-02

US20170033053A1

SUBSTRATE PROCESSING AND ALIGNMENT

#2 | 2007-09-13

US20070210460A1

Substrate processing and alignment

#3 | 2005-01-13

US20050005801A1

Method and device for forming a surface structure on a wafer

InventorID:

1788490 ⎘