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Inventor profile of:

Boning WANG

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2025-01-09

Top Assignees for applications by Boning WANG

The entities that hold a legal rights for patent applications filed by inventor WANG Boning:

BOE TECHNOLOGY GROUP CO., LTD. 10 Beijing, China
Beijing BOE Optoelectronics Technology Co., Ltd. 6 Beijing, China
BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. 3 Beijing, China
Beijing BOE Optoelectronics Technologyy Co., Ltd. 1 Beijing, China

Recent patent applications by WANG Boning

Boning WANG from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-09

US20250015093A1

Electricity

CONNECTION STRUCTURE, DISPLAY PANEL, MANUFACTURING METHOD, DETECTION CIRCUITRY, AND DISPLAY DEVICE

#2 | 2024-12-05

US20240402414A1

Physics

Packaging Member and Manufacturing Method therefor, Backlight Source Assembly, and Display Apparatus

#3 | 2024-09-05

US20240295773A1

Physics

Display device

#4 | 2024-06-06

US20240184166A1

Physics

Display module and preparing method therefor, and display device

#5 | 2022-11-17

US20220364711A1

Mechanical engineering

Light strip, backlight module and display device

#6 | 2022-06-16

US20220187659A1

Physics

Module structure and display device

#7 | 2022-05-26

US20220163719A1

Physics

Backlight module and display device

#8 | 2020-12-10

US20200387031A1

Physics

Backlight module and display device

#9 | 2020-09-17

US20200294456A1

Physics

Method of eliminating black border of display device, display device and detecting device

#10 | 2020-03-12

US20200082750A1

Physics

Display screen, device and luminance compensation method for bezel border

#11 | 2020-03-12

US20200082748A1

Physics

Device for controlling luminance, method thereof, and display device

#12 | 2017-02-09

US20170042041A1

Electricity

Attaching apparatus for chip-on-films

InventorID:

1795684 ⎘