Dublin, California
United States
23
2025-05-15
The entities that hold a legal rights for patent applications filed by inventor ALAPATI Ramakanth:
Ramakanth ALAPATI from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2 | 2025-03-20ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES
#3 | 2025-03-04Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die
#4 | 2024-09-24Hybrid system including photonic and electronic integrated circuits and cooling plate
#5 | 2024-06-13Semiconductor device and method of manufacturing semiconductor device
#6 | 2024-02-06Photonic quantum computer assembly
#7 | 2023-09-21PROCESS CHAMBER WITH UV IRRADIANCE
#8 | 2023-06-22SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#9 | 2023-06-06Hybrid system including photonic and electronic integrated circuits and cooling plate
#10 | 2023-01-10Quantum computing die assembly with thru-silicon vias
#11 | 2022-11-08Quantum computing die assembly with thru-silicon vias and connected logic circuit
#12 | 2022-11-08Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
#13 | 2022-09-22Semiconductor device and method of manufacturing semiconductor device
#14 | 2021-12-30Semiconductor device and method of manufacturing a semiconductor device
#15 | 2021-09-02Semiconductor devices and methods of manufacturing semiconductor devices
#16 | 2021-09-02Active alignment of optical die to optical substrates
#17 | 2021-02-11Semiconductor devices and methods of manufacturing semiconductor devices
#18 | 2020-12-24Semiconductor device and method of manufacturing semiconductor device
#19 | 2020-08-27Semiconductor device and method of manufacturing a semiconductor device
#20 | 2020-06-18Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device
#21 | 2020-05-05Semiconductor device and method of manufacturing a semiconductor device
#22 | 2017-02-23PHOTONIC DEVICES WITH THROUGH DIELECTRIC VIA INTERPOSER
#23 | 2017-01-24Method and process for integration of TSV-middle in 3D IC stacks
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