Inventor profile of:

Ramakanth ALAPATI

City:

Dublin, California

Country:

United States

Published Applications:

23

Last publication date:

2025-05-15

Top Assignees for applications by Ramakanth ALAPATI

The entities that hold a legal rights for patent applications filed by inventor ALAPATI Ramakanth:

Recent patent applications by ALAPATI Ramakanth

Ramakanth ALAPATI from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-05-15
US20250153999A1
Performing operations; transporting

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#2 | 2025-03-20
US20250093230A1
Physics

ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES

#3 | 2025-03-04
US18392124
Physics

Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die

#4 | 2024-09-24
US18142410
Electricity

Hybrid system including photonic and electronic integrated circuits and cooling plate

#5 | 2024-06-13
US20240190700A1
Performing operations; transporting

Semiconductor device and method of manufacturing semiconductor device

#6 | 2024-02-06
US17951916
Physics

Photonic quantum computer assembly

#7 | 2023-09-21
US20230294190A1
Performing operations; transporting

PROCESS CHAMBER WITH UV IRRADIANCE

#8 | 2023-06-22
US20230197769A1
Electricity

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

#9 | 2023-06-06
US17384610
Electricity

Hybrid system including photonic and electronic integrated circuits and cooling plate

#10 | 2023-01-10
US17378533
Physics

Quantum computing die assembly with thru-silicon vias

#11 | 2022-11-08
US17157918
Physics

Quantum computing die assembly with thru-silicon vias and connected logic circuit

#12 | 2022-11-08
US16576626
Physics

Photonic quantum computer assembly having dies with specific contact configuration and matched CTE

#13 | 2022-09-22
US20220298008A1
Performing operations; transporting

Semiconductor device and method of manufacturing semiconductor device

#14 | 2021-12-30
US20210408757A1
Electricity

Semiconductor device and method of manufacturing a semiconductor device

#15 | 2021-09-02
US20210272934A1
Electricity

Semiconductor devices and methods of manufacturing semiconductor devices

#16 | 2021-09-02
US20210270693A1
Physics

Active alignment of optical die to optical substrates

#17 | 2021-02-11
US20210043606A1
Electricity

Semiconductor devices and methods of manufacturing semiconductor devices

#18 | 2020-12-24
US20200399119A1
Performing operations; transporting

Semiconductor device and method of manufacturing semiconductor device

#19 | 2020-08-27
US20200274319A1
Electricity

Semiconductor device and method of manufacturing a semiconductor device

#20 | 2020-06-18
US20200194542A1
Electricity

Semiconductor device having a lid configured as an enclosure and a capacitive structure and method of manufacturing a semiconductor device

#21 | 2020-05-05
US16283752
Electricity

Semiconductor device and method of manufacturing a semiconductor device

#22 | 2017-02-23
US20170054039A1
Electricity

PHOTONIC DEVICES WITH THROUGH DIELECTRIC VIA INTERPOSER

#23 | 2017-01-24
US14858373
Electricity

Method and process for integration of TSV-middle in 3D IC stacks

InventorID:

1806675 ⎘