Austin, Texas
United States
16
2025-01-30
The entities that hold a legal rights for patent applications filed by inventor Foong Chee Seng:
Chee Seng Foong from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR
#2 | 2024-01-11DEVICE PACKAGE SUBSTRATE STRUCTURE AND METHOD THEREFOR
#3 | 2023-05-04STACKING A SEMICONDUCTOR DIE AND CHIP-SCALE-PACKAGE UNIT
#4 | 2022-03-24Packaged semiconductor device assembly
#5 | 2022-02-24Device package substrate structure and method therefor
#6 | 2020-12-17Package with conductive underfill ground plane
#7 | 2020-06-11Hybrid package
#8 | 2020-02-06Method of fabricating embedded traces
#9 | 2020-01-14Substrate dielectric crack prevention using interleaved metal plane
#10 | 2020-01-09HYBRID PACKAGE
#11 | 2018-04-26Substrate interconnections for packaged semiconductor device
#12 | 2018-04-03Laser sintered interconnections between die
#13 | 2018-03-08Micro-selective sintering laser systems and methods thereof
#14 | 2018-01-04Packaged semiconductor device having a lead frame and inner and outer leads and method for forming
#15 | 2017-03-02Universal BGA substrate
#16 | 2017-03-02INTEGRATED CIRCUIT WITH ON-DIE POWER DISTRIBUTION BARS
1814036 ⎘