Rockwall, Texas
United States
5
2020-11-12
The entities that hold a legal rights for patent applications filed by inventor Cook Benjamin:
Benjamin Cook from Rockwall, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#2 | 2019-06-06Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#3 | 2018-05-10Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#4 | 2017-07-13Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#5 | 2017-03-02Semiconductor die substrate with integral heat sink
1814041 ⎘