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Inventor profile of:

Kun-Ei CHEN

City:

Tainan County

Country:

Taiwan

Published Applications:

6

Last publication date:

2025-07-10

Top Assignees for applications by Kun-Ei CHEN

The entities that hold a legal rights for patent applications filed by inventor CHEN Kun-Ei:

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 3 Hsinchu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 1 Hsin-Chu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 1 Hsinchu, Taiwan
  • TAIWAN SEMICONDUCTOR MANUFACTURNING CO., LTD. 1 Hsinchu, Taiwan

Recent patent applications by CHEN Kun-Ei

Kun-Ei CHEN from Tainan County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-10
US20250226322A1
Electricity

INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS

#2 | 2023-11-02
US20230352351A1
Electricity

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

#3 | 2023-10-19
US20230335390A1
Electricity

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

#4 | 2023-09-21
US20230299179A1
Electricity

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

#5 | 2017-03-02
US20170062612A1
Electricity

Method for manufacturing semiconductor device with contamination improvement

#6 | 2007-10-11
US20070238306A1
Electricity

Method of forming dual damascene semiconductor device

InventorID:

1814204 ⎘

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