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Inventor profile of:

Charles E. Carpenter

City:

Orlando, Florida

Country:

United States

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by Charles E. Carpenter

The entities that hold a legal rights for patent applications filed by inventor Carpenter Charles E.:

QORVO US, INC. 3 Greensboro, NC United States
TRIQUINT SEMICONDUCTOR, INC. 2 Hillsboro, OR United States

Recent patent applications by Carpenter Charles E.

Charles E. Carpenter from Orlando, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07

US20260130192A1

Electricity

WAFER-LEVEL CAVITY PACKAGE WITH BACKSIDE TERMINATION

#2 | 2026-01-15

US20260018480A1

Electricity

DOUBLE-SIDED MOLDED HIGH-POWER RF SYSTEM IN PACKAGE - THERMAL SOLUTION

#3 | 2025-11-13

US20250349690A1

Electricity

METAL EDGE FEATURES ON DOUBLE-SIDED PACKAGES

#4 | 2025-08-28

US20250275107A1

Electricity

COMPARTMENTALIZED SHIELDING OF A MODULE UTILIZING SELF-SHIELDED SUB-MODULES

#5 | 2025-08-21

US20250266800A1

Electricity

ACOUSTIC RESONATOR PACKAGE

#6 | 2025-04-10

US20250118648A1

Electricity

MULTILEVEL SYSTEM-IN-PACKAGE MODULE WITH EMBEDDED DIE AND REDISTRIBUTION BOTTOM FEATURES

#7 | 2025-02-27

US20250070042A1

Electricity

MODULE LEVEL COMPARTMENTAL INTEGRATED SHIELDING

#8 | 2025-01-16

US20250022765A1

Electricity

TOP SIDE COOLING FOR POWER AMPLIFIER MODULE

#9 | 2023-08-03

US20230247814A1

Electricity

COMPARTMENTALIZED SHIELDING OF A MODULE UTILIZING SELF-SHIELDED SUB-MODULES

#10 | 2018-04-19

US20180109242A1

Electricity

Surface acoustic wave (SAW) device with antireflective structure

#11 | 2017-02-16

US20170047232A1

Electricity

Low pressure encapsulant for size-reduced semiconductor package

#12 | 2014-09-11

US20140252916A1

Electricity

Acoustic wave device

#13 | 2013-04-11

US20130087379A1

Electricity

HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD

InventorID:

182292 ⎘