Mitaka
Japan
29
2026-05-21
The entities that hold a legal rights for patent applications filed by inventor Yonetsu Maki:
Maki Yonetsu from Mitaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMBRANE ELECTRODE ASSEMBLY, ELECTROLYSIS CELL, AND ELECTROLYSIS DEVICE
#2 | 2026-05-21MEMBRANE ELECTRODE ASSEMBLY, ELECTROLYSIS CELL, AND ELECTROLYSIS DEVICE
#3 | 2026-03-19SEPARATOR, ELECTROCHEMICAL CELL, AND APPARATUS
#4 | 2026-03-19METHOD OF OPERATING ELECTROCHEMICAL REACTION DEVICE AND ELECTROCHEMICAL REACTION DEVICE
#5 | 2026-03-19ELECTROCHEMICAL REACTION DEVICE AND METHOD OF MANUFACTURING ELECTROCHEMICAL REACTION DEVICE
#6 | 2026-03-19ELECTROLYSIS CELL, ELECTROLYSIS DEVICE, AND METHOD OF MANUFACTURING ELECTROLYSIS CELL
#7 | 2025-09-25ELECTROCHEMICAL REACTION DEVICE AND METHOD OF OPERATING ELECTROCHEMICAL REACTION DEVICE
#8 | 2025-03-20ELECTROLYSIS DEVICE, ELECTROLYSIS SYSTEM, AND METHOD OF OPERATING ELECTROLYSIS DEVICE
#9 | 2025-02-06BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD
#10 | 2024-10-31ELECTROLYSIS CELL AND ELECTROLYSIS DEVICE
#11 | 2024-09-26CARBON DIOXIDE ELECTROLYTIC DEVICE AND METHOD OF ELECTROLYZING CARBON DIOXIDE
#12 | 2023-10-12ELECTRODE CATALYST LAYER FOR ELECTROLYTIC CELL, ELECTRODE FOR ELECTROLYTIC CELL, AND CARBON DIOXIDE ELECTROLYTIC DEVICE
#13 | 2023-08-17BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
#14 | 2023-06-15BONDED BODY, CERAMIC CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE
#15 | 2023-05-04BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY
#16 | 2023-05-04BONDED BODY, CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING BONDED BODY
#17 | 2023-03-16Bonded body, ceramic copper circuit substrate, and semiconductor device
#18 | 2022-09-15Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board
#19 | 2022-09-15BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY
#20 | 2021-12-23Bonded body, circuit board, and semiconductor device
#21 | 2021-06-03Structure and bonded body
#22 | 2021-05-27Structure and circuit board
#23 | 2017-09-14Vapor separator and dehumidifier using the same
#24 | 2017-03-16Vapor separator and dehumidifier using the same
#25 | 2011-09-08Nanoparticle composite material and antenna device and electromagnetic wave absorber using the same
#26 | 2009-01-22High-impedance substrate
#27 | 2008-10-30Method of manufacturing high frequency magnetic material
#28 | 2008-07-10Magnetic material and antenna device
#29 | 2008-02-07Insulating magnetic metal particles and method for manufacturing insulating magnetic material
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