Poughkeepsie, New York
United States
14
2020-03-31
The entities that hold a legal rights for patent applications filed by inventor Call Anson J.:
Anson J. Call from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Reduction of laminate failure in integrated circuit (IC) device carrier
#2 | 2020-01-30Connected plane stiffener within integrated circuit chip carrier
#3 | 2019-12-12Semiconductor package metal shadowing checks
#4 | 2019-04-04Semiconductor package metal shadowing checks
#5 | 2019-04-04Semiconductor package via stack checking
#6 | 2018-03-01Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress
#7 | 2018-03-01Reduction of solder interconnect stress
#8 | 2018-01-09Reduction of solder interconnect stress
#9 | 2017-12-07Laminate substrate thermal warpage prediction for designing a laminate substrate
#10 | 2017-05-18Split ball grid array pad for multi-chip modules
#11 | 2017-03-16Split ball grid array pad for multi-chip modules
#12 | 2017-02-07In-plane copper imbalance for warpage prediction
#13 | 2008-11-27Apparatus for crack prevention in integrated circuit packages
#14 | 2008-03-27ELECTRICALLY CONDUCTIVE LIQUID PISTON ENGINE
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