ANDREW D. BAILEY

Plasma etching systems and methods using empirical mode decomposition

Methods of and apparatus for protecting a region of process exclusion adjacent to a region of process performance in a process chamber

Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer

Apparatus for defining regions of process exclusion and process performance in a process chamber

Bevel etcher with gap control

Offset correction techniques for positioning substrates

Offset correction methods and arrangement for positioning and inspecting substrates

Methods and apparatus for determining the thickness of a conductive layer on a substrate

Method for stress free conductor removal

Expert knowledge methods and systems for data analysis

Apparatus and methods to remove films on bevel edge and backside of wafer

Methods and apparatus for optimizing an electrical response to a set of conductive layers on a substrate

System, method and apparatus for self-cleaning dry etch

Apparatus for servicing a plasma processing system with a robot

Methods and arrangement for the reduction of byproduct deposition in a plasma processing system

Plasma oxidation and removal of oxidized material

Small volume process chamber with hot inner surfaces

Materials and gas chemistries for processing systems

Apparatus and methods for improving the stability of RF power delivery to a plasma load

Method for adjusting voltage on a powered Faraday shield

System and method for stress free conductor removal

System, method and apparatus for self-cleaning dry etch

Stress free etch processing in combination with a dynamic liquid meniscus

System and method for surface reduction, passivation, corrosion prevention and activation of copper surface

Small volume process chamber with hot inner surfaces