Tz-Jun Kuo

City:

Hsinchu County

Country:

Taiwan

Published Applications:

Last publication date:

2022-11-03

Top Assignees for applications by Tz-Jun Kuo

The entities that hold a legal rights for patent applications filed by inventor Kuo Tz-Jun:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 4 Hsin-Chu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 2 Hsinchu, Taiwan
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 1 Hsinchu, Taiwan
Taiwan Semiconductor Manufacturing Company Limited 1 Hsinchu, Taiwan

Recent patent applications by Kuo Tz-Jun

Tz-Jun Kuo from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-11-03

US20220352012A1

Electricity

VIA STRUCTURE AND METHODS FOR FORMING THE SAME

#2 | 2021-11-25

US20210366765A1

Electricity

Via structure and methods for forming the same

#3 | 2020-10-29

US20200343177A1

Electricity

Method of forming metal interconnection

#4 | 2020-01-30

US20200035546A1

Electricity

Interconnect structure without barrier layer on bottom surface of via

#5 | 2019-04-18

US20190115297A1

Electricity

Method of forming metal interconnection

#6 | 2019-01-03

US20190006230A1

Electricity

Interconnect structure without barrier layer on bottom surface of via

#7 | 2017-06-29

US20170186685A1

Electricity

Method of forming metal interconnection

#8 | 2017-03-30

US20170092536A1

Electricity

Method of forming metal interconnection

#9 | 2017-03-23

US20170084483A1

Electricity

Method of forming metal interconnection

InventorID:

1832675 ⎘