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Inventor profile of:

Liam Cheevers

City:

Lexlip

Country:

Ireland

Published Applications:

1

Last publication date:

2017-03-23

Top Assignees for applications by Liam Cheevers

The entities that hold a legal rights for patent applications filed by inventor Cheevers Liam:

Hewlett-Packard Development Company, L.P. 1 Houston, TX United States

Recent patent applications by Cheevers Liam

Liam Cheevers from Lexlip, IE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-03-23

US20170084533A1

Interconnects through dielectric vias

InventorID:

1832701 ⎘