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Inventor profile of:

Hideya MURAI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2014-12-18

Top Assignees for applications by Hideya MURAI

The entities that hold a legal rights for patent applications filed by inventor MURAI Hideya:

NEC Corporation 23 Tokyo, Japan
RENESAS ELECTRONICS CORPORATION 7 Kanagawa, Japan
NEC ELECTRONICS CORPORATION 7 Kanagawa, Japan
NEC CORPORATION 4 Minato-ku, Tokyo, Japan
NEC Electronics Corporation 2 Kawasaki, Japan
NEC ELECTRONICS CORPORATION 2 Kawasaki-shi, Japan
RENESAS ELECTRONICS CORPORATION 1 Kawasaki-shi, Kanagawa, Japan
Renesas Electronics Corporation 1 Kawasaki, Kanagawa, Japan
C/O RENESAS ELECTRONICS CORPORATION 1 Kanagawa, Japan

Recent patent applications by MURAI Hideya

Hideya MURAI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-12-18

US20140367863A1

Electricity

SEMICONDUCTOR DEVICE

#2 | 2014-01-23

US20140024177A1

Electricity

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#3 | 2013-05-23

US20130127037A1

Electricity

SEMICONDUCTOR DEVICE BUILT-IN SUBSTRATE

#4 | 2013-04-11

US20130087927A1

Electricity

MULTIMEDIA PROVIDING SERVICE

#5 | 2012-12-20

US20120319254A1

Electricity

Wiring board with built-in semiconductor element

#6 | 2012-06-21

US20120153501A1

Electricity

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#7 | 2011-11-17

US20110281401A1

Electricity

Semiconductor device manufacturing method

#8 | 2011-07-21

US20110175213A1

Electricity

Semiconductor device and manufacturing method thereof

#9 | 2011-06-09

US20110136298A1

Electricity

Method of manufacturing a wiring board

#10 | 2011-05-26

US20110121445A1

Electricity

Semiconductor device and method for manufacturing the same

#11 | 2011-01-06

US20110003472A1

Electricity

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

#12 | 2010-12-16

US20100314778A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

#13 | 2010-09-30

US20100244231A1

Electricity

Semiconductor device

#14 | 2010-09-16

US20100232127A1

Electricity

WIRING BOARD COMPOSITE BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE WIRING BOARD COMPOSITE BODY AND THE SEMICONDUCTOR DEVICE

#15 | 2010-04-29

US20100103634A1

Electricity

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

#16 | 2009-12-24

US20090315190A1

Electricity

Wiring board, semiconductor device using wiring board and their manufacturing methods

#17 | 2009-02-19

US20090046441A1

Electricity

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

#18 | 2009-01-29

US20090026636A1

Electricity

Semiconductor device and method of manufacturing same

#19 | 2009-01-01

US20090001604A1

Electricity

Semiconductor Package and Method for Producing Same

#20 | 2008-12-11

US20080303136A1

Electricity

Semiconductor device and method for manufacturing same

#21 | 2008-10-23

US20080258283A1

Electricity

Wiring board and semiconductor package using the same

#22 | 2006-12-21

US20060283629A1

Electricity

Wiring board and method for manufacturing the same

#23 | 2006-12-21

US20060283625A1

Electricity

Wiring board, method for manufacturing same, and semiconductor package

#24 | 2006-01-19

US20060012048A1

Electricity

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

#25 | 2006-01-19

US20060012029A1

Electricity

Semiconductor device

#26 | 2006-01-17

US10350077

In-plane switching liquid crystal display unit having tinting compensation

#27 | 2005-12-22

US20050281995A1

Electricity

Sheet material and wiring board

#28 | 2005-12-01

US20050264743A1

Physics

In-plane-switching liquid crystal display unit

#29 | 2005-11-17

US20050252682A1

Electricity

Wiring board and semiconductor package using the same

InventorID:

183338 ⎘