Austin, Texas
United States
14
2026-01-22
The entities that hold a legal rights for patent applications filed by inventor Su Michael:
Michael Su from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES
#2 | 2025-10-02Through Package Vertical Interconnect and Method of Making Same
#3 | 2025-09-18Through Package Vertical Interconnect and Method of Making Same
#4 | 2025-08-28Semiconductor Package with Integrated Capacitors
#5 | 2025-06-26EMBEDDED VOLTAGE REGULATION MODULE
#6 | 2025-01-09Semiconductor Package with Integrated Capacitors
#7 | 2024-10-10Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive Substrate
#8 | 2024-08-01Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive Inks
#9 | 2024-04-11Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in Substrates
#10 | 2023-12-21Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate
#11 | 2023-12-07Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the Same
#12 | 2023-10-26Through Package Vertical Interconnect and Method of Making Same
#13 | 2023-09-14Semiconductor package with integrated capacitors
#14 | 2017-03-30VIA CAPACITOR
1839637 ⎘