Tanja Braun

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2020-06-04

Top Assignees for applications by Tanja Braun

The entities that hold a legal rights for patent applications filed by inventor Braun Tanja:

Tanja Braun from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Waver-level packaging based module and method for producing the same

Wafer level package with integrated or embedded antenna

Wafer level package with integrated antennas and means for shielding

Wafer level package with at least one integrated antenna element

Method for manufacturing an electronic component and an electronic component

Method for producing encapsulated chips

InventorID:

1844622 ⎘