Michael Töpper

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2023-02-02

Top Assignees for applications by Michael Töpper

The entities that hold a legal rights for patent applications filed by inventor Töpper Michael:

Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. 2 Munchen, Germany
Technische Universitat Berlin 1 Berlin, Germany
University of Utah Research Foundation 1 Salt Lake City, UT United States
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAN 1 MUNICH, Germany
University of Utah Reasearch Foundation 1 Salt Lake City, UT United States
Fraunhofer-Gesellschaft zur Förderund der angewandten Forschung e.V. 1 Munich, Germany
Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. 1 Munich, Germany

Recent patent applications by Töpper Michael

Michael Töpper from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-02-02

US20230033251A1

Chemistry; metallurgy

METHOD OF JOINING GLASS ELEMENTS WITH MATERIAL CONTINUITY, GLASS COMPONENT, AND HOUSING, AND VACUUM INSULATING GLASS PANEL COMPRISING THE GLASS COMPONENT

#2 | 2017-08-17

US20170236799A1

Electricity

Bonding method for connecting two wafers

#3 | 2017-04-06

US20170098611A1

Electricity

Method for manufacturing an electronic component and an electronic component

#4 | 2009-11-05

US20090273910A1

Electricity

Functional Unit And Method For The Production Thereof

#5 | 2008-04-24

US20080096379A1

Electricity

Flip chip metallization method and devices

#6 | 2008-01-24

US20080021525A1

Human necessities

In vivo implantable coil assembly

InventorID:

1844624 ⎘