Hiroshi UEDA

City:

Shiga

Country:

Japan

Published Applications:

Last publication date:

2026-05-07

Top Assignees for applications by Hiroshi UEDA

The entities that hold a legal rights for patent applications filed by inventor UEDA Hiroshi:

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. 6 Shiga, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 5 Osaka, Japan
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. 4 Koka-shi, Shiga, Japan
Sumitomo Electric Industries, Ltd. 3 Osaka-shi, Osaka, Japan

Recent patent applications by UEDA Hiroshi

Hiroshi UEDA from Shiga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07

US20260129754A1

Electricity

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

#2 | 2021-12-16

US20210392754A1

Electricity

Printed wiring board and manufacturing method thereof

#3 | 2021-01-21

US20210022254A1

Electricity

Method of making flexible printed circuit board and flexible printed circuit board

#4 | 2020-12-03

US20200376810A1

Performing operations; transporting

Resin film, substrate for printed wiring board, and printed wiring board

#5 | 2020-09-10

US20200288578A1

Electricity

Base material for printed circuit board and printed circuit board

#6 | 2020-01-16

US20200022262A1

Electricity

Printed wiring board and manufacturing method thereof

#7 | 2017-10-05

US20170290150A1

Electricity

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

#8 | 2017-05-11

US20170135206A1

Electricity

Printed circuit board, electronic component, and method for producing printed circuit board

#9 | 2017-05-04

US20170127516A1

Electricity

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

#10 | 2017-04-06

US20170099732A1

Electricity

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

InventorID:

1845430 ⎘