Jerusalem
Israel
30
2026-10-01
The entities that hold a legal rights for patent applications filed by inventor Israel Abraham:
Abraham Israel from Jerusalem, IL has applied for patents for these inventions. The list has both pending applications and granted patents:
Mechanical Socket and Detachable Connectors for Co-Packaged Optics
#2 | 2026-04-09Substrate Misalignment Measurement
#3 | 2025-12-25Optical Coupling
#4 | 2025-09-25High-Density Optical Coupling
#5 | 2025-08-21Co-Packaged Optics
#6 | 2025-07-24Detachable Connector for Co-Packaged Optics
#7 | 2025-03-13Optical Coupling
#8 | 2025-02-20Wideband Surface Coupling
#9 | 2025-01-23Optical and Electrical Packaging of Photonic Dies
#10 | 2024-11-21Electrical and Optical Semiconductor Probe Head
#11 | 2024-09-05Detachable Connectors for Co-Packaged Optics
#12 | 2024-04-11Optical Coupling
#13 | 2023-09-21Optical coupling
#14 | 2023-08-10Optical Coupling
#15 | 2023-08-10Optical coupling
#16 | 2023-07-20Optical coupling
#17 | 2023-07-13Optical Coupling
#18 | 2023-06-22METHOD OF MAKING AND USING A BACKSIDE OPTICAL COUPLER FOR COUPLING OF SINGLE-MODE FIBER TO A SILICON PHOTONICS CHIP
#19 | 2023-06-22Backside optical connector
#20 | 2023-05-18Co-packaged optics
#21 | 2023-04-27DETACHABLE CONNECTOR FOR CO-PACKAGED OPTICS
#22 | 2023-03-16Optical Coupling
#23 | 2023-02-02WIDEBAND SURFACE COUPLING
#24 | 2021-06-03Wideband surface coupling
#25 | 2021-01-07Waveguide mode coupling
#26 | 2020-09-03Fiberless co-packaged optics
#27 | 2019-10-24Wideband surface coupling
#28 | 2018-02-15Fiber to chip optical coupler
#29 | 2018-02-01Electro-optical interconnect platform
#30 | 2017-04-13Fiber to chip optical coupler
1848006 ⎘