Hsinchu County
Taiwan
39
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor Chen Hsin-Ping:
Hsin-Ping Chen from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
#2 | 2025-11-06INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
#3 | 2025-10-30METAL LINES OF HYBRID HEIGHTS
#4 | 2025-10-02SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#5 | 2025-07-24SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
#6 | 2025-05-01INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
#7 | 2025-04-17SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#8 | 2025-04-03INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
#9 | 2025-03-06HYBRID METAL LINE STRUCTURE
#10 | 2024-10-10INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS
#11 | 2024-09-05SEMICONDUCTOR DEVICE WITH SPACERS FOR SELF ALIGNED VIAS
#12 | 2024-06-13SEMICONDCUTOR DEVICES AND METHODS OF FORMING THE SAME
#13 | 2023-11-16Semiconductor device and method of manufacture
#14 | 2023-09-14SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
#15 | 2023-09-07Hybrid metal line structure
#16 | 2023-08-31METAL LINES OF HYBRID HEIGHTS
#17 | 2022-09-29Hybrid metal line structure
#18 | 2022-07-28Gate all around device
#19 | 2022-06-09Semiconductor device with spacers for self aligned vias
#20 | 2022-05-19Integrated circuit interconnect structures with air gaps
#21 | 2021-08-05Semiconductor device and method of manufacture
#22 | 2021-07-29Semiconductor device with conductors embedded in a substrate
#23 | 2021-05-06Semiconductor device with spacers for self aligned vias
#24 | 2021-03-04Semiconductor device and method of manufacture
#25 | 2021-02-04Semiconductor structure and method for manufacturing the same
#26 | 2020-12-24Fabrication of gate all around device
#27 | 2020-09-24Nano-electromechanical system (NEMS) device structure and method for forming the same
#28 | 2020-05-28Dual spacer metal patterning
#29 | 2020-01-02Integrated circuit interconnect structures with air gaps
#30 | 2019-10-24Semiconductor structure and method for manufacturing the same
#31 | 2019-10-03Fabrication of gate all around device
#32 | 2019-08-08Vertical MOS transistor
#33 | 2019-03-28Gate all around device and fabrication thereof
#34 | 2019-02-28Structure and formation method of interconnection structure of semiconductor device
#35 | 2018-11-22Nano-electromechanical system (NEMS) device structure and method for forming the same
#36 | 2018-10-25Vertical MOS transistor and fabricating method thereof
#37 | 2018-05-17Interconnect structure including air gap
#38 | 2017-07-27Nano-electromechanical system (NEMS) device structure and method for forming the same
#39 | 2017-04-13Metal lines for interconnect structure and method of manufacturing same
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