Inventor profile of:

Jay W. Strane

City:

Warwick, New York

Country:

United States

Published Applications:

18

Last publication date:

2020-06-18

Top Assignees for applications by Jay W. Strane

The entities that hold a legal rights for patent applications filed by inventor Strane Jay W.:

Recent patent applications by Strane Jay W.

Jay W. Strane from Warwick, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-06-18
US20200194314A1
Electricity

Dual width finned semiconductor structure

#2 | 2020-06-04
US20200176332A1
Electricity

Controlling active fin height of FinFET device using etch protection layer to prevent recess of isolation layer during gate oxide removal

#3 | 2020-05-14
US20200152520A1
Electricity

Semiconductor fins with dielectric isolation at fin bottom

#4 | 2020-01-23
US20200027796A1
Electricity

Controlling active fin height of FinFET device

#5 | 2019-12-19
US20190385916A1
Electricity

Controlling active fin height of FinFET device using etch protection layer to prevent recess of isolation layer during gate oxide removal

#6 | 2019-12-05
US20190371678A1
Electricity

Dual width finned semiconductor structure

#7 | 2019-10-10
US20190311955A1
Electricity

Semiconductor fins with dielectric isolation at fin bottom

#8 | 2019-02-28
US20190067079A1
Electricity

Protection of low temperature isolation fill

#9 | 2019-02-28
US20190067078A1
Electricity

Protection of low temperature isolation fill

#10 | 2017-08-17
US20170236756A1
Electricity

Uniform dielectric recess depth during fin reveal

#11 | 2017-08-17
US20170236717A1
Electricity

Uniform dielectric recess depth during fin reveal

#12 | 2017-05-04
US20170125302A1
Electricity

Uniform dielectric recess depth during fin reveal

#13 | 2017-05-04
US20170125286A1
Electricity

Uniform dielectric recess depth during fin reveal

#14 | 2012-08-16
US20120208332A1
Electricity

Semiconductor structures having improved contact resistance

#15 | 2012-05-31
US20120132966A1
Electricity

Semiconductor structures having improved contact resistance

#16 | 2011-12-08
US20110298017A1
Electricity

Replacement gate MOSFET with self-aligned diffusion contact

#17 | 2010-01-14
US20100006926A1
Electricity

Methods for forming high performance gates and structures thereof

#18 | 2007-10-25
US20070249149A1
Electricity

IMPROVED THERMAL BUDGET USING NICKEL BASED SILICIDES FOR ENHANCED SEMICONDUCTOR DEVICE PERFORMANCE

InventorID:

1867625 ⎘