Furth
Germany
16
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor Spann Thomas:
Thomas Spann from Furth, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
METAL TAB FOR POWER SEMICONDUCTOR MODULE
#2 | 2025-02-20METAL TAB FOR POWER SEMICONDUCTOR MODULE
#3 | 2024-10-24METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR PACKAGE
#4 | 2024-01-11HIGH RELIABILITY SEMICONDUCTOR PACKAGE DESIGN
#5 | 2022-03-17Electrical contact for semiconductor package
#6 | 2021-09-02Metal tab for chip assembly
#7 | 2021-09-02POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN
#8 | 2019-10-03Power Semiconductor Device Module Having Mechanical Corner Press-Fit Anchors
#9 | 2019-08-15Heat transfer plate having small cavities for taking up a thermal transfer material
#10 | 2018-10-04Heat transfer plate having small cavities for taking up a thermal transfer material
#11 | 2018-06-19Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
#12 | 2017-11-02Power semiconductor device module having mechanical corner press-fit anchors
#13 | 2017-05-04Bridging DMB structure for wire bonding in a power semiconductor module
#14 | 2016-09-13Bridging DMB structure for wire bonding in a power semiconductor device module
#15 | 2013-06-04Electrically isolated power semiconductor package with optimized layout
#16 | 2011-12-15Method for the manufacture of double-sided metalized ceramic substrates
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