Manchaca, Texas
United States
21
2023-11-16
The entities that hold a legal rights for patent applications filed by inventor Mangrum Marc Alan:
Marc Alan Mangrum from Manchaca, US has applied for patents for these inventions. The list has both pending applications and granted patents:
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS
#2 | 2023-10-19Packaged electronic device having integrated antenna and locking structure
#3 | 2021-08-26Flip chip curved sidewall self-alignment features for substrate and method for manufacturing the self-alignment features
#4 | 2021-05-20Packaged electronic device having integrated antenna and locking structure
#5 | 2020-05-14Packaged electronic device having integrated antenna and locking structure
#6 | 2019-04-25Semiconductor package having inspection structure and related methods
#7 | 2019-02-07Flip chip self-alignment features for substrate and leadframe applications
#8 | 2018-12-27Embedded vibration management system having an array of vibration absorbing structures
#9 | 2018-12-06Semiconductor package having inspection structure and related methods
#10 | 2018-07-24Flip chip self-alignment features for substrate and leadframe applications
#11 | 2018-07-24Embedded vibration management system
#12 | 2018-07-05Packaged electronic device having integrated antenna and locking structure
#13 | 2018-01-11Semiconductor package with clip alignment notch
#14 | 2017-10-26Method of forming a semiconductor package with conductive interconnect frame and structure
#15 | 2017-05-04Packaged electronic device having integrated antenna and locking structure
#16 | 2016-06-07Shielding technique for semiconductor package including metal lid
#17 | 2015-10-06Shielding technique for semiconductor package including metal lid and metalized contact area
#18 | 2008-06-19Circuit device with at least partial packaging and method for forming
#19 | 2006-01-19Circuit device with at least partial packaging and method for forming
#20 | 2005-07-26Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
#21 | 2005-01-04Circuit device with at least partial packaging and method for forming
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