Hitoshi ISHIKAWA

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2017-05-11

Top Assignees for applications by Hitoshi ISHIKAWA

The entities that hold a legal rights for patent applications filed by inventor ISHIKAWA Hitoshi:

Hitoshi ISHIKAWA from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of forming a metal layer and method of manufacturing a substrate having such metal layer

InventorID:

1871741 ⎘