Jun Iijima

City:

Sendai-shi

Country:

Japan

Published Applications:

Last publication date:

2013-04-11

Top Assignees for applications by Jun Iijima

The entities that hold a legal rights for patent applications filed by inventor Iijima Jun:

Jun Iijima from Sendai-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor device having a multilevel interconnect structure and method for fabricating the same

Semiconductor device having a multilevel interconnect structure and method for fabricating the same

InventorID:

187178 ⎘