Phoenix, Arizona
United States
17
2025-05-08
The entities that hold a legal rights for patent applications filed by inventor TRUHITTE Darrell D.:
Darrell D. TRUHITTE from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#2 | 2020-11-19LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#3 | 2019-12-26SEMICONDUCTOR PACKAGE WITH INTEGRATED HEAT SINK
#4 | 2019-06-27Wafer level flat no-lead semiconductor packages and methods of manufacture
#5 | 2019-06-27Wafer level flat no-lead semiconductor packages and methods of manufacture
#6 | 2019-06-27Wafer level flat no-lead semiconductor packages and methods of manufacture
#7 | 2019-04-25Leadless semiconductor packages, leadframes therefor, and methods of making
#8 | 2019-03-21Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#9 | 2019-01-10Damaging components with defective electrical couplings
#10 | 2019-01-03Carrier tape with standoff units
#11 | 2018-06-21Wafer level flat no-lead semiconductor packages and methods of manufacture
#12 | 2018-05-24Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
#13 | 2018-02-22Damaging components with defective electrical couplings
#14 | 2017-11-23Carrier tape with standoff units
#15 | 2017-05-23Wafer-scale marking systems and related methods
#16 | 2017-05-11Leadless semiconductor packages, leadframes therefor, and methods of making
#17 | 2005-02-17Method of forming a leadframe for a semiconductor package
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